Apparatus and method for forming a wire bundle and coupling the wire bundle to a structure

ABSTRACT

A method of forming a wire bundle, the method includes removably coupling a plurality of wire bundle mounting structures to a wire bundle form board, the plurality of wire bundles mounting structures being coupled to the wire bundle form board in a predetermined pattern corresponding to a configuration of the wire bundle. The method also includes inserting one or more wires, of the wire bundle, into the plurality of wire bundle mounting structures, coupling the one or more wires to the plurality of wire bundle mounting structures with a respective wire bundle retention strap of each of the plurality of wire bundle mounting structures so as to form the wire bundle, and removing the one or more wires and the plurality of wire bundle mounting structures from the wire bundle form board as a singular unit.

BACKGROUND 1. Field

The exemplary embodiments generally relate to wire bundling and moreparticularly to apparatus to form wire bundles and couple the wirebundles to a structure.

2. Brief Description of Related Developments

Generally wire bundles for vehicles, such as aircraft, are formed usinga form board into which pegs are manually inserted. Wires that form thewire bundle are then placed on the form board around the pegs so as toform the wire bundle into a predetermined configuration. Once the wiresforming the wire bundle are placed on the form board and routed aroundthe pegs, the wires are tied together, such as by wrapping the wireswith a tape, coupling the wires together with tie wraps, etc.

Generally each form board, and the pegs coupled thereto, is specific toa respective wire bundle predetermined configuration. As such, amanufacturer of wire bundles generally has to store at least one formboard for each predetermined configuration of wire bundle themanufacturer produces. This storage of the form boards occupies floorspace that could otherwise be put to use for more profitable operationsof the manufacturer.

Further, the wire bundles that are formed are generally coupled tostructures using metal or composite spanner bars. These metal spannerbars have nut runners extending therefrom to couple the spanner bars tothe structure and to provide mounting locations for the wire bundles.Generally installation of the nut runners onto the spanner bar requiresaccessing fasteners from a back side of the spanner bars (e.g., a sideof the spanner bar opposite the side on which the nut runners arelocated). As such, the spanner bars are manufactured with pass throughs(e.g., spaces between the spanner bar and the structure to which thespanner bar is coupled). These pass throughs increase the distancebetween the structure and the wire bundles. With the spanner barsinstalled on the structure the wire bundles are coupled to the nutrunners using tie wraps. Installation of the spanner bars and wirebundles in this manner may be time consuming as tools are needed to bothinstall the spanner bars and couple the wire bundles to the nut runnersof the spanner bars. In addition, the metal spanner bars and nut runnersincrease the weight of the vehicle which may reduce fuel efficiency ofthe vehicle.

SUMMARY

Accordingly, apparatuses and methods, intended to address at least oneor more of the above-identified concerns, would find utility.

The following is a non-exhaustive list of examples, which may or may notbe claimed, of the subject matter according to the present disclosure.

One example of the subject matter according to the present disclosurerelates to a fixture for coupling wire bundles to a structure, thefixture comprising: at least one wire bundle mounting structure, the atleast one wire bundle mounting structure having quick connect (this willbe described in the specification as a snap together coupling that isfacilitated without tools) mounting features, and quick connect strapretention features; a spanner bar having mating quick connect mountingfeatures that mate with the quick connect mounting features of the atleast one wire bundle mounting structure for coupling the at least onewire bundle mounting structure to the spanner bar; and a wire bundleretention strap having a first end pivotally coupled to the at least onewire bundle mounting structure, and a second end having mating quickconnect strap retention features that mate with the quick connect strapretention features of the at least one wire bundle mounting structure tocouple the second end to the at least one wire bundle mountingstructure.

Another example of the subject matter according to the presentdisclosure relates to a fixture for coupling wire bundles to astructure, the fixture comprising: a plurality of wire bundle mountingstructures, each wire bundle mounting structure including a frame, quickconnect mounting features coupled to the frame, quick connect strapretention features coupled to the frame, a wire bundle retention straphaving a first end pivotally coupled to the frame, and a second endhaving mating quick connect strap retention features that mate with thequick connect strap retention features; and a longitudinally extendedspanner bar having a plurality of wire bundle mounting recesses spacedalong a longitudinal length of the spanner bar, each wire bundlemounting recess including mating quick connect mounting features thatmate the quick connect mounting features of a respective wire bundlemounting structure for coupling the at least one wire bundle mountingstructure to the spanner bar.

Still another example of the subject matter according to the presentdisclosure relates to a method of coupling wire bundles to a structure,the method comprising: coupling a wire bundle mounting structure to awire bundle with a wire bundle retention strap extending through thewire bundle mounting structure, where the wire bundle retention straphas a first end pivotally coupled to a frame of the wire bundle mountingstructure, and a second end having mating quick connect strap retentionfeatures that mate with quick connect strap retention features of thewire bundle mounting structure; coupling a spanner bar to the structure;and coupling the wire bundle mounting structure, with the wire bundlecoupled thereto, to the spanner bar, where the wire bundle mountingstructure is coupled to a wire bundle mounting recesses of the spannerbar with quick connect mounting features of the spanner bar that matethe quick connect mounting features of the wire bundle mountingstructure.

Another example of the subject matter according to the presentdisclosure relates to a method of forming a wire bundle, the methodcomprising: removably coupling a plurality of wire bundle mountingstructures to a wire bundle form board, the plurality of wire bundlesmounting structures being coupled to the wire bundle form board in apredetermined pattern corresponding to a configuration of the wirebundle; inserting one or more wires, of the wire bundle, into theplurality of wire bundle mounting structures; coupling the one or morewires to the plurality of wire bundle mounting structures with arespective wire bundle retention strap of each of the plurality of wirebundle mounting structures so as to form the wire bundle; and removingthe one or more wires and the plurality of wire bundle mountingstructures from the wire bundle form board as a singular unit.

Yet another example of the subject matter according to the presentdisclosure relates to a method of forming a wire bundle, the methodcomprising: inserting at least one wire into at least one wire bundlemounting structure; and coupling the at least one wire to the at leastone wire bundle mounting structure with a respective wire bundleretention strap extending through a respective wire bundle mountingstructure, where each wire bundle retention strap has a first endpivotally coupled to a frame of the respective wire bundle mountingstructure, and a second end having mating quick connect strap retentionfeatures that mate with quick connect strap retention features of therespective wire bundle mounting structure; wherein the at least one wirebundle mounting structure is common to both arranging the at least onewire in a predetermined configuration for the formation of the wirebundle, and mounting the wire bundle to a structure.

Still another examples of the subject matter according to the presentdisclosure relates to a wire bundle forming apparatus comprising: a wirebundle form board having a plurality of mounting structure couplings;and at least one wire bundle mounting structure configured to couplewith the plurality of mounting structure couplings for removablycoupling the at least one wire bundle mounting structure to the wirebundle form board in a predetermined pattern corresponding to apredetermined configuration of a wire bundle, where, the at least onewire bundle mounting structure has a wire receiving portion in whichwires, forming the wire bundle, are placed and coupled to the at leastone wire bundle mounting structure, and the at least one wire bundlemounting structure is common to both arranging the at least one wire inthe predetermined configuration for the formation of the wire bundle,and, when removed from the wire bundle form board with the wire bundlecoupled to the at least one wire bundle mounting structure, a fixturefor coupling the wire bundle to a structure.

BRIEF DESCRIPTION OF THE DRAWINGS

Having thus described examples of the present disclosure in generalterms, reference will now be made to the accompanying drawings, whichare not necessarily drawn to scale, and wherein like referencecharacters designate the same or similar parts throughout the severalviews, and wherein:

FIG. 1 is a schematic isometric illustration of a fixture for coupling awire bundle to a structure in accordance with aspects of the presentdisclosure;

FIG. 1A is a schematic isometric illustration of a portion of thefixture for coupling a wire bundle to a structure of FIG. 1 inaccordance with aspects of the present disclosure;

FIG. 2A is a schematic isometric illustration of an exemplary wirebundle mounting structure of the fixture of FIG. 1 in accordance withaspects of the present disclosure;

FIG. 2B is a schematic cross-sectional illustration of the exemplarywire bundle mounting structure of FIG. 2A in accordance with aspects ofthe present disclosure;

FIG. 2C is a schematic illustration of a bottom view of the exemplarywire bundle mounting structure of FIG. 2A in accordance with aspects ofthe present disclosure;

FIG. 3A is a schematic illustration of a side view of a wire bundleretention strap of the fixture illustrated in FIG. 1 in accordance withaspects of the present disclosure;

FIG. 3B is a schematic illustration of a top view of the wire bundleretention strap of the fixture illustrated in FIG. 1 in accordance withaspects of the present disclosure;

FIG. 4A is a schematic illustration of an exemplary wire bundle coupledto the exemplary wire bundle mounting structure of FIG. 2A in accordancewith aspects of the present disclosure;

FIG. 4B is a schematic illustration of an exemplary wire bundle coupledto another exemplary wire bundle mounting structure of FIG. 2A inaccordance with aspects of the present disclosure;

FIG. 4C is a schematic illustration of an exemplary wire bundle coupledto the exemplary wire bundle mounting structure of FIG. 4B in accordancewith aspects of the present disclosure;

FIG. 5 is a schematic illustration of another exemplary wire bundlemounting structure in accordance with aspects of the present disclosure;

FIG. 6A is a schematic illustration of a wire bundle forming apparatusin accordance with aspects of the present disclosure;

FIG. 6B is a schematic illustration of a portion of the wire bundleforming apparatus in accordance with aspects of the present disclosure;

FIG. 7 is a schematic illustration of an exemplary vehicle includingaspects of the present disclosure;

FIG. 8 is a flow diagram of an exemplary method for coupling wirebundles to a structure in accordance with aspects of the presentdisclosure;

FIG. 9 is a flow diagram of an exemplary method for forming a wirebundle in accordance with aspects of the present disclosure; and

FIG. 10 is a flow diagram of an exemplary method for forming a wirebundle in accordance with aspects of the present disclosure.

DETAILED DESCRIPTION

Referring to FIGS. 1, 6A, and 7 the aspects of the present disclosureprovide for the formation of wire bundles 600 and the coupling of thewire bundles 600 to a structure 190 where a wire bundle mountingstructure 110 is common to both the formation of the wire bundles 600and the coupling of the wire bundles 600 to the structure 190. Thestructure may be any suitable structure of, for example, anarchitectural structure or a vehicle 700 (FIG. 7). The vehicle 700 isillustrated as a fixed wing aircraft 701 having a frame 780, wings 706,and engines 708. The frame 780 includes longitudinally spaced framemembers 781 and stringers 782 that form, with an exterior skin 710 ofthe aircraft 701, a fuselage 702. The fuselage 702 has a cabin area 720.In other aspects, the vehicle 700 may be any suitable maritime vessel,submersible vehicle, fixed wing and/or rotary wing aircraft, terrestrialvehicle (e.g., automobile, armored vehicle, etc.), or extraterrestrialvehicle (e.g., spacecraft, satellite, orbital reentry vehicle, etc.). Inone aspect, the wire bundles 600 may be coupled, as described herein, tothe longitudinally spaced frame members 781, the stringers 782, or toany other structure of the aircraft 701.

In accordance with the aspects of the present disclosure a wire bundleforming apparatus 610 is provided. The wire bundle forming apparatusincludes a wire bundle form board 620 that is reconfigurable for theformation of a number of different wire bundle configurations. Thereconfiguration of the wire bundle form board 620 provides amanufacturer the ability to form wire bundles 600 having differentconfiguration with a common wire bundle form board 620. The use of thecommon wire bundle form board 620 reduces the required storage areaallocated for storing the wire bundle form boards 620 within themanufacturing facility.

In accordance with the aspects of the present disclosure a fixture 100for coupling wire bundles to the structure 190 is also provided. Thefixture 100 includes a spanner bar 105 and at least one wire bundlemounting structure 110. The wire bundle mounting structure 110 iscoupled to the fixture 100 with “quick connect” mounting features, wherethe term “quick connect” defines a snap or twist coupling that couplestwo structures to each other without the use of tools. The fixture 100provides for a tool-less installation of the wire bundle mountingstructure 110, and the wire bundle 600 coupled thereto, to the spannerbar 105 without accessing a back side 189 of the spanner bar 105 (e.g.,a side of the spanner bar opposite the wire bundle mounting structure110). The tool-less installation of the provided for by the fixture 100may reduce wire bundle installation time and reduce cost of producingthe vehicle 700. The installation of the wire bundle mounting structure110, without back side access, may provide for increased space in whichthe wire bundles may be placed as the spanner bar 105 may be configuredwith a reduced height 188 (e.g., so that the wire bundle mountingstructure 110 and the wire bundles coupled thereto are disposed closerto the structure 190 than in conventional installations).

As noted above, the wire bundle mounting structure 110 is common to boththe fixture 100 and the wire bundle forming apparatus 610. This providesfor the formation of a wire bundle 600 with the wire bundle mountingstructure 110 and the coupling of the wire bundle 600 to the wire bundlemounting structure 110, where the wire bundle 600 and the wire bundlemounting structure 110 are removed from the wire bundle form board 620as a single unit for transport to the vehicle 700 and coupling with thespanner bar 105. This again, may reduce installation times and decreasethe cost of producing the vehicle 700.

Illustrative, non-exhaustive examples, which may or may not be claimed,of the subject matter according to the present disclosure are providedbelow.

Referring now to FIGS. 1 and 2A-2C, the fixture 100 includes at leastone wire bundle mounting structure 110 and a spanner bar 105. As can beseen in FIG. 1, the at least one wire bundle mounting structure 110 mayinclude a plurality of wire bundle mounting structures 110, 110A, 110B,110C (generally referred to as wire bundle mounting structures 110). Theat least one wire bundle mounting structure 110 includes quick connectmounting features 111 and quick connect strap retention features 120.Each of the at least one wire bundle mounting structure 110 includes aframe 112 having a first mounting structure end 113 and a secondmounting structure end 114. The quick connect mounting features 111include at least one protrusion 115 disposed at each of the firstmounting structure end 113 and the second mounting structure end 114.The at least one protrusion 115 of the quick connect mounting features111 includes at least one first protrusion 115A disposed on one of thefirst mounting structure end 113 and the second mounting structure end114. The at least one protrusion 115 of the quick connect mountingfeatures 111 also includes at least one second protrusion 115B disposedon the other of the first mounting structure end 113 and the secondmounting structure end 114.

Referring to FIGS. 2A-2C, the quick connect strap retention features 120includes a guide channel 200 and a cantilevered toothed member 210. Theguide channel 200 is formed by the frame 112 and has an open side 201.The cantilevered toothed member 210 is formed by the frame 112 and isdisposed at the open side 201 of the guide channel 200. The cantileveredtoothed member 210 is resilient so that a free end 211 of thecantilevered toothed member 210 moves in direction 212 relative to theguide channel 200. The cantilevered toothed member 210 includesdirectional teeth 215 along at least a portion of the cantileveredtoothed member 210.

The at least one wire bundle mounting structure 110 also includes anaxle bearing surface 220 and a retention strap aperture 230 through theaxle bearing surface 220. Both the axle bearing surface 220 and theretention strap aperture 230 are formed by the frame 112.

Referring to FIGS. 1, 2A, 2B, and 2C, the spanner bar 105 includes aframe 150. The frame 150 is longitudinally extended along a longitudinalaxis 151 so as to have a length 155. The frame 150 forms a plurality ofwire bundle mounting recesses 170 spaced along the longitudinal length155 of the spanner bar 105, where each wire bundle mounting recess 170is configured to couple with a respective one of the plurality of wirebundle mounting structures. Each wire bundle mounting recess 170 isformed at least in part by respective mating quick connect mountingfeatures 156 that mate or otherwise couple with the quick connectmounting features 111 of a respective one of the at least one wirebundle mounting structure 110 for coupling the at least one wire bundlemounting structure 110 to the spanner bar 105. In the example shown inFIG. 1, the spanner bar 105 has the length 155 that accommodates foursets of mating quick connect mounting features 156 for coupling fourwire bundle mounting structures 110, 110A, 110B, 110C to the spanner bar105; however, in other aspects, the length 155 may be any suitablelength for accommodating coupling more or less than four wire bundlemounting structures 110, 110A, 110B, 110C to the spanner bar.

The mating quick connect mounting features 156 include flexure members157 and recesses 158. The flexure members 157 are configured to snapover and retain the at least one first protrusion 115A. For example,flexure members 157 include a ramped engagement surface 159 and aretention surface 160 (see FIGS. 1 and 4A). The recess 158 is configuredto receive the at least one second protrusion 115B, where the couplingbetween the recess 158 and the at least one second protrusion 115B formsa fulcrum 182 (e.g., pivot point—see FIGS. 1 and 4A) of the quickconnect mounting features 111 when the respective wire bundle mountingstructure 110 is being inserted into the wire bundle mounting recess170. For example, to insert a wire bundle mounting recess 170 into awire bundle mounting recess 170 the at least one second protrusion 115Bis inserted into the recess 158 and the second mounting structure end114 is pivoted about the fulcrum 182 so that the at least one firstprotrusion 115A contacts the flexure members 157. The contact betweenthe at least one first protrusion 115A and the ramped engagement surface159 causes the flexure members 157 to flex in direction 163 (FIG. 4A)and allow passage of the at least one wire bundle mounting structure 110into the respective wire bundle mounting recess so that once theretention surface 160 of the flexure members 157 passes the at least onefirst protrusion, the flexure members 157 returns (e.g., snaps back) toits original, un-flexed, position and the retention surface 160 coupleswith engagement surface 161 so that the recess 158 and the retentionsurface 160 retain the wire bundle mounting structure 110 within thewire bundle mounting recess 170. The wire bundle mounting structure 110may be removed from the wire bundle mounting recess 170 in substantiallythe reverse manner to that described above, where the flexure members157 are manually flexed away from the at least one first protrusion 115Ato release the at least one first protrusion 115A (e.g., the retentionsurface 160 and the engagement surface 161 are decoupled) and allowrotation of the wire bundle mounting structure 110, about the fulcrum182, away from the spanner bar 105. As described above, the quickconnect mounting features 111 of the at least one wire bundle mountingstructure 110 and the mating quick connect mounting features 156 of thespanner bar 105 are configured so that the at least one wire bundlemounting structure 110 is coupled to the spanner bar 105 with singleside spanner bar access (i.e., the side of the spanner bar 105 oppositethe structure 190 as shown in FIG. 1).

While the quick connect features 111 and mating quick connect features156 are described as “snap” connectors, in other aspects any suitablequick connect coupling may be used. For example, as can be seen in FIG.1A, the at least one wire bundle mounting structure 110 may include aquarter turn threaded stud 103 that interfaces with a respective quarterturn threaded aperture 104 of the spanner bar 105. The spanner bar mayinclude a protrusion or detent mechanism 102 that substantially preventsrotation of the at least one wire bundle mounting structure 110 in adirection 119 opposite an installation rotation direction 118 tosubstantially prevent unintentional de-coupling of the at least one wirebundle mounting structure 110 from the spanner bar 105.

Referring to FIGS. 1 and 4A, each wire bundle mounting recess 170includes a wire bundle mounting structure support surface 140 that isconfigured to couple with a bottom surface 250 of a respective wirebundle mounting structure 110. At least one of the wire bundle mountingstructure support surface 140 being disposed along a different planethan another one of the wire bundle mounting structure support surface140 of another wire bundle mounting recess 170. For example, thedistance 195 (FIG. 1) between the at least one wire bundle mountingstructure support surface 140 and a mounting surface 197 of the spannerbar 105 is different than a distance 196 between another one of the wirebundle mounting structure support surface 140 and the mounting surface197 of the spanner bar 105. Placing the wire bundle mounting structures110 on different planes may provide for spacing between the wire bundles600 coupled thereto. It is noted that the mounting surface 197 of thespanner bar 105 is illustrated in FIG. 1 as being substantiallystraight, but in other aspects the mounting surface 197 may have anysuitable contour that substantially matches a surface of the structure190 to which the spanner bar 105 is to be coupled.

Referring to FIG. 1, in another aspect, the fixture 100 includes atleast one spacer 130 that is configured to increase, for example, one ormore of the distance 195, 196. The spacer 130 includes a spanner barcoupling 131 that is substantially similar to the quick connect mountingfeatures 111 of the wire bundle mounting structures 110. The spacer 130also includes a mounting structure coupling 132 that is substantiallysimilar to the mating quick connect mounting features 156 of the spannerbar 105. The spacer 130 may have any suitable height 138 for placing awire bundle mounting structure 110 coupled thereto at a desired heightrelative to other wire bundle mounting structures 110 coupled to thespanner bar 105. In one aspect, the spacer 130 may be selectable from anumber of different spacers 130, 130A, 130B, one or more of which has adifferent height 138 than other ones of the different spacers 130, 130A,130B.

Referring to FIG. 1, the spanner bar 105 includes one or more mountingfeatures 165 configured to couple the spanner bar 105 to the structure190. The one or more mounting features 165 include one or more ofapertures (through which mechanical fasteners 166, 167 are inserted),snaps 168, or any other suitable mechanical fasteners (such as quickconnect couplings substantially similar to those between the spanner bar105 and the wire bundle mounting structures 110). The at least one wirebundle mounting structure 110 is longitudinally spaced along the spannerbar 105 so that the one or more mounting features 165 are accessiblebetween adjacent wire bundle mounting structures 110.

Referring to FIGS. 3A, 3B, and 4A, the fixture 100 also includes a wirebundle retention strap 300. The wire bundle retention strap 300 includesa first end 301 and a second end 302. A pivot axle 310 is disposed atthe first end 301 and a strap portion 320 extends from the pivot axle310 to form the second end 302. The first end 301 is configured topivotally couple to the at least one wire bundle mounting structure 110.For example, referring also to FIGS. 2B and 2C, the retention strapaperture 230 is configured to receive the strap portion 320 of the wirebundle retention strap 300 and the axle bearing surface 220 couples withthe pivot axle 310 so as to prevent passage of the pivot axle 310through the retention strap aperture 230. The second end 302 includesmating quick connect strap retention features 305 that mate with thequick connect strap retention features 120 of the at least one wirebundle mounting structure 110 to couple the second end 302 to the atleast one wire bundle mounting structure 110.

As can be seen in FIG. 4A, the first end 301 of the wire bundleretention strap 300 is pivotally coupled to the respective wire bundlemounting structure 110 adjacent the first mounting structure end 113 sothat the wire bundle retention strap 300 extends from the retentionstrap aperture 230 around a wire bundle 600 being coupled to the wirebundle mounting structure 110 by the wire bundle retention strap 300.Here the wire bundle retention strap 300 and a wire bundle interfacesurface 125 of the at least one wire bundle mounting structure 110 forma wire bundle passage loop 450 through which one or more wire bundlesextend 600. The wire bundle interface surface 125 forms a wire receivingportion 126 (FIG. 4A) in which wires 601 (FIG. 4A), forming the wirebundle 600, are placed and coupled to the at least one wire bundlemounting structure 110. The mating quick connect strap retentionfeatures 305 extend along a predetermined length of the wire bundleretention strap 300 so that the wire bundle passage loop has a variablysized wire passage aperture 451 (noting FIG. 4A illustrates a largerwire passage aperture 451 and a smaller wire passage aperture) that maydepend on a cross-sectional size of the wire bundle 600 being coupled tothe respective wire bundle mounting structure by the wire bundleretention strap 300. The variably sized wire passage aperture 451provides for coupling wire bundles 600 of varying cross-section (e.g.,from a single wire to a wire bundle of any suitable size having anysuitable number of wires therein) to the at least one wire bundlemounting structure 110.

To form the wire bundle passage loop 450 the second end 302 of the wirebundle retention strap 300 is coupled to the respective wire bundlemounting structure 110 by the quick connect strap retention features 120adjacent the second mounting structure end 114. For example, the quickconnect strap retention features 120 couple with the mating quickconnect strap retention features 305 as the second end 302 is pulledthrough the guide channel 200. The quick connect strap retentionfeatures 120 and the mating quick connect strap retention features 305form a ratchet coupling 470 that is configured so that the wire bundleretention strap 300 passes through the quick connect strap retentionfeatures 120 in a single non-reversible direction 490.

As noted above, the at least one wire bundle mounting structure 110 mayinclude a plurality of wire bundle mounting structures 110, 110A, 110B,110C. In one aspect, one or more of the wire bundle mounting structures110, 110A, 110B, 110C may be different (e.g., have differentpredetermined characteristics) than another of the plurality of wirebundle mounting structures 110, 110A, 110B, 110C. Here, the at least onewire bundle mounting structure 110 is selectable from a number ofdifferent wire bundle mounting structures 110, 110A, 110B, 110C, whereat least one of the different wire bundle mounting structures 110, 110A,110B, 110C has a different wire bundle interface surface 125 (e.g., adifferent predetermined characteristic) than another of the differentwire bundle mounting structures 110, 110A, 110B, 110C. For example, thewire bundle interface surface 125 of wire bundle mounting structure 110may be different (e.g., have a larger or smaller radius) than the wirebundle interface surface 125 of the wire bundle mounting structure 110A.Referring to FIGS. 4B and 4C, one or more of the wire bundle mountingstructures 110 may be configured with a different wire bundle retentionstrap guide channel 410 (e.g., a different predetermined characteristic)for use with a conventional tie wrap 400. For example, 110E the wirebundle retention strap guide channel 410 may be a tooth-less passagethrough which the tie wrap 400 is inserted where the ends of the tiewrap 400 are coupled in a conventional manner.

Referring to FIG. 5 the at least one of the wire bundle mountingstructure 110 includes stackable coupling features (e.g., a differentpredetermined characteristic) substantially similar to that of thespacer 130. For example, wire bundle mounting structure 110D issubstantially similar to the wire bundle mounting structures describedabove; however, in this aspect the wire bundle mounting structure 110Dincludes a stanchion portion 500 that includes stackable couplingfeatures 532 that are configured to couple at least two wire bundlemounting structures to each other in a stacked configuration (in FIG. 5wire bundle mounting structures 110D and 110A are coupled to eachother). The stackable coupling features 532 are substantially similar tothe mounting structure coupling 132 of the spacer 130 described above.The wire bundle mounting structure 110D may also include a pivotingsupport member 520 coupled to the frame 512 of the wire bundle mountingstructure 110D. The pivoting support member 520 may pivot in direction560 so as to couple with a detent 530 or other structure of thestanchion portion 500 to provide structural support to the stanchionportion 500. The pivoting support member 520 may be coupled with thedetent 530 after the wire bundle is coupled to the wire bundle mountingstructure 110D in the manner described herein.

For exemplary purposes, the wire bundle retention strap 300 comprises anylon material. In other aspects, the wire bundle retention strap 300comprises a cross-linked polytetrafluoroethylene material. Also forexemplary purposes, one or more of the wire bundle mounting structure110 and the spanner bar 105 comprise a metal. In other aspects, one ormore of the wire bundle mounting structure 110 and the spanner bar 105comprise a plastic material. In still other aspects, one or more of thewire bundle mounting structure 110 and the spanner bar 105 comprise acomposite material. In other aspects, the wire bundle retention strap300, the wire bundle mounting structure 110, and the spanner bar 105 maybe constructed of any suitable material(s).

Referring to FIG. 6, the at least one wire bundle mounting structure 110described herein may also form part of the wire bundle forming apparatus610. The wire bundle forming apparatus includes a wire bundle form board620 having a plurality of mounting structure couplings 615 and at leastone wire bundle mounting structure 110 configured to couple with theplurality of mounting structure couplings 615 for removably coupling theat least one wire bundle mounting structure 110 to the wire bundle formboard 620 in a predetermined pattern 612 corresponding to apredetermined configuration 613 of the wire bundle 600. The at least onewire bundle mounting structure 110 is common to both (1) arranging theat least one wire 601 (FIG. 4A) in the predetermined configuration 613for the formation of the wire bundle 600, and, (2) when removed from thewire bundle form board 620 with the wire bundle 600 coupled to the atleast one wire bundle mounting structure 110, the fixture 100 forcoupling the wire bundle 600 to the structure 190.

In a manner similar to that described above with respect to the spannerbar 105, the quick connect mounting features 111 of the at least onewire bundle mounting structure 110 and the plurality of mountingstructure couplings 615 of the wire bundle form board 620 are configuredso that the at least one wire bundle mounting structure 110 is coupledto wire bundle form board 620 with single side form board access. Forexample, referring to FIG. 6B, each of the plurality of mountingstructure couplings 615 (one of which is shown in FIG. 6B) of the wirebundle form board 620 are substantially similar to the mating quickconnect mounting features 156 of the spanner bar 105. Here, theplurality of mounting structure couplings 615 form a plurality of wirebundle mounting recesses 170 that are arranged in a grid 650 where eachwire bundle mounting recess 170 is configured to couple with arespective one of the plurality of wire bundle mounting structures 110in the manner described above with respect to the spanner bar 105. Thewire bundle mounting structure support surface 140 of the mountingstructure couplings 615 may be disposed a distance 690 from a surface691 of the form board to provide access to, for example, the wire bundleretention strap 300 (see also FIG. 4A) for pulling the second end 302 ofthe wire bundle retention strap 300 to couple the wire bundle 600 to thewire bundle mounting structures 110. The mounting structure couplings615 may also include a channel 673 (the spanner bar 105 may include asimilar channel—see FIGS. 1 and 4A) through which at least a portion ofthe wire bundle retention strap 300 passes so that an operator may pullthe wire bundle retention strap 300 to couple the wire bundle 600 to thewire bundle mounting structures 110.

The wire bundle forming apparatus 610 may also include any suitablerobot 660 configured to at least couple the at least one wire bundlemounting structure 110 to the wire bundle form board 620 in thepredetermined pattern 612. For example, the robot 660 may include anysuitable transport arm 661 having a gripper 662 that picks up wirebundle mounting structures 110 from a storage location, transports thewire bundle mounting structures 110 to the wire bundle form board 620,and couples the wire bundle mounting structures 110 (carried by thegripper 662) to predetermined mounting structure couplings 615 of thewire bundle form board 620. The robot 660 may include any suitablemachine vision system 663 and/or location sensors 664 for identifyingthe predetermined mounting structure couplings 615 and coupling wirebundle mounting structures 110 to the predetermined mounting structurecouplings 615.

As described above, the form board is reconfigurable so that wirebundles having different configurations may be formed with a common wirebundle form board 620. The robot 660 includes a memory in which thedifferent configurations of the wire bundles are stored. The memory mayalso include any suitable non-transitory computer program codecorresponding to the different wire bundle configurations so that acontroller 666 of the robot 660 may send instructions to the transportarm 661 for placing the wire bundle mounting structures 110 on the wirebundle form board in a predetermined pattern 612 that corresponds with aselected one of the wire bundle configurations.

Referring now to FIGS. 1, 3A, 3B, 4A, and 8, an exemplary method ofcoupling wire bundles 600 to a structure 190 will be described. A wirebundle mounting structure 110 is coupled to a wire bundle 600 (FIG. 8,Block 800) with a wire bundle retention strap 300 extending through thewire bundle mounting structure 110, where the wire bundle retentionstrap 300 has a first end 301 pivotally coupled to a frame 112 of thewire bundle mounting structure 110, and a second end 302 having matingquick connect strap retention features 305 that mate with quick connectstrap retention features 120 of the wire bundle mounting structure 110.Here the wire bundle retention strap 300 is inserted through the wirebundle mounting structure 110 at opposite ends (e.g., the first mountingstructure end 113 and the second mounting structure end 114) of the wirebundle mounting structure 110 to form a wire bundle passage loop 450. Asize of the wire bundle passage loop 450 formed by the wire bundleretention strap 300 and the wire bundle mounting structure 110 isadjusted by pulling the second end 302 of the wire bundle retentionstrap 300 through the wire bundle mounting structure 110. Coupling thewire bundle mounting structure 110 to a wire bundle 600 includesinserting the wire bundle 600 into the wire bundle mounting structure110, such as into the wire receiving portion 126 (FIGS. 1 and 4A), andcoupling the wire bundle 600, disposed within the wire bundle mountingstructure 110, to the wire bundle mounting structure 110 with the wirebundle retention strap 300.

Block 800 of FIG. 8 may be repeated any suitable number of timesdepending on the predetermined configuration 613 of the wire bundle 600.For example, another wire bundle mounting structure 110 may be coupledto the wire bundle 600 with another wire bundle retention strap 300extending through the other wire bundle mounting structure 110, wherethe wire bundle mounting structure 110 and the other wire bundlemounting structure 110A are spaced a predetermined distance 605 fromeach other along a length of the wire bundle 600. The predetermineddistance 605 may correspond to a distance between frame longitudinallyspaced members 781 (or any other suitable features, such as thestringers 782, etc.) of the frame 780 of fuselage 702 (see FIG. 7).

A spanner bar 105 is coupled to the structure 190 (FIG. 8, Block 810)such as with any suitable mechanical fasteners as described above. Thewire bundle mounting structure 110, with the wire bundle 600 coupledthereto, is coupled to the spanner bar 105 (FIG. 8, Block 820), wherethe wire bundle mounting structure 110 is coupled to a wire bundlemounting recesses 170 of the spanner bar 105 with quick connect mountingfeatures 156 of the spanner bar 105 that mate the quick connect mountingfeatures 111 of the wire bundle mounting structure 110. In one aspect,depending on, e.g., a length of the wire bundle, another spanner bar105A (FIG. 1) is coupled to the structure 190, where the spanner bar 105and the other spanner bar 105A are spaced from each other by thepredetermined distance 605. Here, each of the wire bundle mountingstructure 110 and the other wire bundle mounting structure 110A, withthe wire bundle 600 coupled thereto, are coupled to a respective one ofthe spanner bar 105 and the other spanner bar 105A. In one aspect, onewire bundle mounting structure 110 may be coupled to another wire bundlemounting structure 110D (FIG. 5) and/or a spacer 130 (FIG. 1) in astacked arrangement.

Referring to FIGS. 1, 4A, 6 and 9, an exemplary method of forming a wirebundle will be described. A plurality of wire bundle mounting structures110 are removably coupled to a wire bundle form board 620 (FIG. 9 Block900). The plurality of wire bundles mounting structures 110 are coupledto the wire bundle form board 620 in a predetermined pattern 612corresponding to a configuration (e.g., shape, wire routing, etc.) 613of the wire bundle 600. In one aspect, the wire bundle mountingstructures 110 are removably coupled to the wire bundle form board 620with a robotic automation (e.g., robot 660). In other aspects, the wirebundle mounting structures 110 are removably coupled to the wire bundleform board 620 manually. The wire bundle mounting structures 110 areremovably coupled to the wire bundle form board 620 according to indicia683 (e.g., numbers, patterns, colors, lights, etc.), disposed on thewire bundle form board 620, specifying placement locations of the wirebundle mounting structures 110 for a predetermined wire bundle 600configuration 613. As noted above, the wire bundle form board 620 iscommon to a first wire bundle 600 and a second wire bundle 600A (FIG.6), where the second wire bundle 600A has a different configuration 613Athan the first wire bundle 600.

One or more wires 601 (FIG. 4A), of the wire bundle 600, are insertedinto the plurality of wire bundle mounting structures 110 (FIG. 9, Block910). The one or more wires 601 are coupled to the plurality of wirebundle mounting structures 110 (FIG. 9, Block 920) with a respectivewire bundle retention strap 300 of each of the plurality of wire bundlemounting structures 110 so as to form the wire bundle 600. Therespective wire bundle retention strap 300 is inserted into a respectivewire bundle mounting structure 110, where the respective wire bundleretention strap 300 has a first end 301 pivotally coupled to a frame 112of the respective wire bundle mounting structure 110, and a second end302 having mating quick connect strap retention features 305 that matewith quick connect strap retention features 120 of the respective wirebundle mounting structure 110. The respective wire bundle retentionstrap 300 is inserted through the respective wire bundle mountingstructure 110 at opposite ends (e.g., first mounting structure end 113and second mounting structure end 114) of the respective wire bundlemounting structure to form a wire bundle passage loop 450. A size of thewire bundle passage loop 450 formed by the respective wire bundleretention strap 300 and the respective wire bundle mounting structure110 is adjusted by pulling the second end 302 of the wire bundleretention strap 300 through the respective wire bundle mountingstructure 110.

The one or more wires 601 and the plurality of wire bundle mountingstructures 110 are removed from the wire bundle form board 620 as asingular unit (FIG. 9, Block 930). In one aspect, another plurality ofwire bundle mounting structures 110 may be coupled in a stackedarrangement (in the manner described above) to at least some of theplurality of wire bundle mounting structures 110 coupled to the wirebundle form board 620. One or more different wires 680, 681 may beinserted into the other plurality of wire bundle mounting structures 110and the one or more different wires 680, 681 are coupled to the otherplurality of wire bundle mounting structures 110 so as to form anotherwire bundle 600B (FIG. 6A) that is stacked on the wire bundle 600(referred to as the first wire bundle). The first wire bundle 600 andthe other wire bundle 600B are removed from the wire bundle form board620 as the singular unit.

Referring to FIGS. 1, 4A, 6, and 10 another exemplary method for forminga wire bundle 600 will be described. At least one wire 601 (FIG. 4A) isinserted into at least one wire bundle mounting structure 110 (FIG. 10,Block 1000). The at least one wire 601 is coupled to the at least onewire bundle mounting structure 110 (FIG. 10, Block 1010) with arespective wire bundle retention strap 300 extending through arespective wire bundle mounting structure 110. The respective wirebundle retention strap 300 is inserted into the respective wire bundlemounting structure 110, where each wire bundle retention strap 300 has afirst end 301 pivotally coupled to a frame 112 of the respective wirebundle mounting structure 110, and a second end 302 having mating quickconnect strap retention features 305 that mate with quick connect strapretention features 120 of the respective wire bundle mounting structure110. The respective wire bundle retention strap 300 is inserted throughthe respective wire bundle mounting structure 110 at opposite ends(e.g., the first mounting structure end 113 and the second mountingstructure end 114) of the respective wire bundle mounting structure 110to form a wire bundle passage loop 450. A size of the wire bundlepassage loop 450 formed by the respective wire bundle retention strap300 and the respective wire bundle mounting structure 110 is adjusted bypulling the second end 302 of the wire bundle retention strap 300through the respective wire bundle mounting structure 110. The at leastone wire bundle mounting structure 110 is common to both arranging theat least one wire 601 in a predetermined configuration 613 for theformation of the wire bundle 600, and mounting the wire bundle 600 to astructure 190.

The at least one wire bundle mounting structure 110, with the at leastone wire 601 coupled thereto, is coupled to at least one spanner bar105, where the at least one wire bundle mounting structure 110 iscoupled to a respective wire bundle mounting recesses 170 of arespective spanner bar 105 with quick connect mounting features 156 ofthe respective spanner bar 105 that mate the quick connect mountingfeatures 111 of the at least one wire bundle mounting structure 110.

The at least one wire bundle mounting structure 110 may be removablycoupled to a wire bundle form board 620 (FIG. 10, Block 1020) in apredetermined pattern 612 corresponding to a configuration 613 (shape,routing or wires, etc.) of the wire bundle 600. In one aspect, the atleast one wire bundle mounting structure 110 is removably coupled to thewire bundle form board 620 with a robotic automation (e.g., robot 660);while in other aspects the wire bundle mounting structure may beremovably coupled to the wire bundle form board 620 manually. The atleast one wire bundle mounting structure is removably coupled to thewire bundle form board according to indicia, disposed on the wire bundleform board, specifying placement locations of the wire bundle mountingstructures for a predetermined wire bundle. The wire bundle form board620 is common to a first wire bundle 600 and a second wire bundle 600A,where the second wire bundle 600A has a different configuration than thefirst wire bundle 600.

The following examples are provided in accordance with the aspects ofthe present disclosure:

A1. A fixture for coupling wire bundles to a structure, the fixturecomprising:

at least one wire bundle mounting structure, the at least one wirebundle mounting structure having

quick connect (this will be described in the specification as a snaptogether coupling that is facilitated without tools) mounting features,and

quick connect strap retention features;

a spanner bar having mating quick connect mounting features that matewith the quick connect mounting features of the at least one wire bundlemounting structure for coupling the at least one wire bundle mountingstructure to the spanner bar; and

a wire bundle retention strap having

a first end pivotally coupled to the at least one wire bundle mountingstructure, and

a second end having mating quick connect strap retention features thatmate with the quick connect strap retention features of the at least onewire bundle mounting structure to couple the second end to the at leastone wire bundle mounting structure.

A2. The fixture of paragraph A1, wherein:

the wire bundle retention strap includes a pivot axle and a strapportion extending from the pivot axle, and

the at least one wire bundle mounting structure includes an axle bearingsurface and a retention strap aperture through the axle bearing surface,the retention strap aperture being configured to receive the strapportion of the wire bundle retention strap and the axle bearing surfacecouples with the pivot axle so as to prevent passage of the pivot axlethrough the retention strap aperture.

A3. The fixture of paragraph A1, wherein the wire bundle retention strapand the at least one wire bundle mounting structure form a wire bundlepassage loop through which one or more wire bundles extend.

A4. The fixture of paragraph A3, wherein the mating quick connect strapretention features extend along a predetermined length of the wirebundle retention strap so that the wire bundle passage loop has avariably sized wire passage aperture.

A5. The fixture of paragraph A1, where the quick connect strap retentionfeatures and the mating quick connect strap retention features form aratchet coupling.

A6. The fixture of paragraph A5, wherein the ratchet coupling isconfigured so that the wire bundle retention strap passes through thequick connect strap retention features in a single non-reversibledirection.

A7. The fixture of paragraph A1, wherein the quick connect strapretention features comprise:

a guide channel having an open side; and

a cantilevered toothed member disposed at the open side of the guidechannel.

A8. The fixture of paragraph A7, wherein the cantilevered tooth memberis resilient so that a free end of the cantilevered tooth member movesrelative to the guide channel.

A9. The fixture of paragraph A1, wherein:

the quick connect mounting features of the at least one wire bundlemounting structure include at least one first protrusion; and

the mating quick connect mounting features include flexure membersconfigured to snap over and retain the at least one first protrusion.

A10. The fixture of paragraph A1, wherein:

the quick connect mounting features of the at least one wire bundlemounting structure include at least one second protrusion; and

the mating quick connect mounting features of the spanner bar include arecess into which the at least one second protrusion is received, wherethe coupling between the recess and the at least one second protrusionforms a fulcrum of the quick connect mounting features.

A11. The fixture of paragraph A1, wherein:

each of the at least one wire bundle mounting structure includes a framehaving a first mounting structure end and a second mounting structureend; and

the quick connect mounting features include at least one protrusiondisposed at each of the first mounting structure end and the secondmounting structure end.

A12. The fixture of paragraph A11, wherein:

the first end of the wire bundle retention strap is pivotally coupled toa respective wire bundle mounting structure adjacent the first mountingstructure end; and

the second end of the wire bundle retention strap is coupled to therespective wire bundle mounting structure (by the quick connect strapretention features) adjacent the second mounting structure end.

A13. The fixture of paragraph A1, wherein:

the at least one wire bundle mounting structure includes a plurality ofwire bundle mounting structures; and

the quick connect mounting features form a plurality of wire bundlemounting recesses, the plurality of wire bundle mounting recesses beingspaced along a longitudinal length of the spanner bar where each wirebundle mounting recess is configured to couple with a respective one ofthe plurality of wire bundle mounting structures.

A14. The fixture of paragraph A13, wherein each wire bundle mountingrecess includes a wire bundle mounting structure support surface, atleast one of the wire bundle mounting structure support surface beingdisposed along a different plane than another one of the wire bundlemounting structure support surface of another wire bundle mountingrecess.

A15. The fixture of paragraph A1, wherein the spanner bar includes oneor more mounting features configured to couple the spanner bar to thestructure.

A16. The fixture of paragraph A15, wherein the one or more mountingfeatures include one or more of apertures and snaps.

A17. The fixture of paragraph A15, wherein the one or more mountingfeatures include mechanical fasteners.

A18. The fixture of paragraph A15, wherein the structure is a frame ofan aircraft.

A19. The fixture of paragraph A15, wherein the at least one wire bundlemounting structure is longitudinally spaced along the spanner bar sothat the one or more mounting features are accessible between adjacentwire bundle mounting structures.

A20. The fixture of paragraph A1, wherein at least one of the wirebundle mounting structure includes stackable coupling features, thestackable coupling features being configured to couple at least two wirebundle mounting structures to each other in a stacked configuration.

A21. The fixture of paragraph A1, wherein the quick connect mountingfeatures of the at least one wire bundle mounting structure and themating quick connect mounting features of the spanner bar are configuredso that the at least one wire bundle mounting structure is coupled tothe spanner bar with single side spanner bar access.

A22. The fixture of paragraph A1, where the at least one wire bundlemounting structure is selectable from a number of different wire bundlemounting structures, at least one of which has a different wire bundleinterface surface than another of the different wire bundle mountingstructures.

A23. The fixture of paragraph A1, wherein the wire bundle retentionstrap comprises a nylon material.

A24. The fixture of paragraph A1, wherein the wire bundle retentionstrap comprises a cross-linked polytetrafluoroethylene material.

A25. The fixture bar of paragraph A1, wherein one or more of the wirebundle mounting structure and the spanner bar comprise a metal.

A26. The fixture of paragraph A1, wherein one or more of the wire bundlemounting structure and the spanner bar comprise a plastic material.

A27. The fixture of paragraph A1, wherein one or more of the wire bundlemounting structure and the spanner bar comprise a composite material.

B1. A fixture for coupling wire bundles to a structure, the fixturecomprising:

a plurality of wire bundle mounting structures, each wire bundlemounting structure including

a frame,

quick connect mounting features coupled to the frame,

quick connect strap retention features coupled to the frame,

a wire bundle retention strap having a first end pivotally coupled tothe frame, and a second end having mating quick connect strap retentionfeatures that mate with the quick connect strap retention features; and

a longitudinally extended spanner bar having a plurality of wire bundlemounting recesses spaced along a longitudinal length of the spanner bar,each wire bundle mounting recess including mating quick connect mountingfeatures that mate the quick connect mounting features of a respectivewire bundle mounting structure for coupling the at least one wire bundlemounting structure to the spanner bar.

B2. The fixture of paragraph B2, wherein:

the wire bundle retention strap includes a pivot axle and a strapportion extending from the pivot axle, and

the at least one wire bundle mounting structure includes an axle bearingsurface and a retention strap aperture through the axle bearing surface,the retention strap aperture being configured to receive the strapportion of the wire bundle retention strap and the axle bearing surfacecouples with the pivot axle so as to prevent passage of the pivot axlethrough the retention strap aperture.

B3. The fixture of paragraph B1, wherein the wire bundle retention strapand the frame form a wire bundle passage loop through which one or morewire bundles extend.

B4. The fixture of paragraph B3, wherein the mating quick connect strapretention features extend along a predetermined length of the wirebundle retention strap so that the wire bundle passage loop has avariably sized wire passage aperture.

B5. The fixture of paragraph B1, where the quick connect strap retentionfeatures and the mating quick connect strap retention features form aratchet coupling.

B6. The fixture of paragraph B5, wherein the ratchet coupling isconfigured so that the wire bundle retention strap passes through thequick connect strap retention features in a single non-reversibledirection.

B7. The fixture of paragraph B1, wherein the quick connect strapretention features comprise:

a guide channel having an open side; and

a cantilevered toothed member disposed at the open side of the guidechannel.

B8. The fixture of paragraph B7, wherein the cantilevered tooth memberis resilient so that a free end of the cantilevered tooth member movesrelative to the guide channel.

B9. The fixture of paragraph B1, wherein:

the quick connect mounting features of the at least one wire bundlemounting structure include at least one first protrusion; and

the mating quick connect mounting features include flexure membersconfigured to snap over and retain the at least one first protrusion.

B10. The fixture of paragraph B1, wherein:

the quick connect mounting features of the at least one wire bundlemounting structure include at least one second protrusion; and

the mating quick connect mounting features of the spanner bar include arecess into which the at least one second protrusion is received, wherethe coupling between the recess and the at least one second protrusionforms a fulcrum of the quick connect mounting features.

B11. The fixture of paragraph B1, wherein:

the frame of each wire bundle mounting structure has a first mountingstructure end and a second mounting structure end; and

the quick connect mounting features include at least one protrusiondisposed at each of the first mounting structure end and the secondmounting structure end.

B12. The fixture of paragraph B11, wherein:

the first end of the wire bundle retention strap is pivotally coupled tothe frame adjacent the first mounting structure end; and

the second end of the wire bundle retention strap is coupled to theframe (by the quick connect strap retention features) adjacent thesecond mounting structure end.

B13. The fixture of paragraph B1, wherein each wire bundle mountingrecess includes a wire bundle mounting structure support surface, atleast one of the wire bundle mounting structure support surface beingdisposed along a different plane than another one of the wire bundlemounting structure support surface of another wire bundle mountingrecess.

B14. The fixture of paragraph B1, wherein the spanner bar includes oneor more mounting features configured to couple the spanner bar to thestructure.

B15. The fixture of paragraph B14, wherein the one or more mountingfeatures include one or more of apertures and snaps.

B16. The fixture of paragraph B14, wherein the one or more mountingfeatures include mechanical fasteners.

B17. The fixture of paragraph B14, wherein the structure is a frame ofan aircraft.

B18. The fixture of paragraph B14, wherein the plurality of wire bundlemounting structures are longitudinally spaced along the spanner bar sothat the one or more mounting features are accessible between adjacentwire bundle mounting structures.

B19. The fixture of paragraph B1, wherein at least one of the pluralityof wire bundle mounting structures includes stackable coupling features,the stackable coupling features being configured to couple at least twowire bundle mounting structures to each other in a stackedconfiguration.

B20. The fixture of paragraph B1, wherein the quick connect mountingfeatures of each wire bundle mounting structure and the mating quickconnect mounting features of the spanner bar are configured so that thewire bundle mounting structure is coupled to the spanner bar with singleside spanner bar access.

B21. The fixture of paragraph B1, where at least one of the plurality ofwire bundle mounting structures has a different wire bundle interfacesurface than another of the plurality of wire bundle mountingstructures.

B22. The fixture of paragraph B1, wherein the wire bundle retentionstrap comprises a nylon material.

B23. The fixture of paragraph B1, wherein the wire bundle retentionstrap comprises a cross-linked polytetrafluoroethylene material.

B24. The fixture bar of paragraph B1, wherein one or more of the wirebundle mounting structure and the spanner bar comprise a metal.

B25. The fixture of paragraph B1, wherein one or more of the wire bundlemounting structure and the spanner bar comprise a plastic material.

B26. The fixture of paragraph B1, wherein one or more of the wire bundlemounting structure and the spanner bar comprise a composite material.

C1. A method of coupling wire bundles to a structure, the methodcomprising:

coupling a wire bundle mounting structure to a wire bundle with a wirebundle retention strap extending through the wire bundle mountingstructure, where the wire bundle retention strap has a first endpivotally coupled to a frame of the wire bundle mounting structure, anda second end having mating quick connect strap retention features thatmate with quick connect strap retention features of the wire bundlemounting structure;

coupling a spanner bar to the structure; and

coupling the wire bundle mounting structure, with the wire bundlecoupled thereto, to the spanner bar, where the wire bundle mountingstructure is coupled to a wire bundle mounting recesses of the spannerbar with quick connect mounting features of the spanner bar that matethe quick connect mounting features of the wire bundle mountingstructure.

C2. The method of paragraph C1, further comprising inserting the wirebundle retention strap through the wire bundle mounting structure atopposite ends of the wire bundle mounting structure to form a wirebundle passage loop.

C3. The method of paragraph C2, further comprising adjusting a size ofthe wire bundle passage loop formed by the wire bundle retention strapand the wire bundle mounting structure by pulling the second end of thewire retention strap through the wire bundle mounting structure.

C4. The method of paragraph C1, further comprising coupling another wirebundle mounting structure to the wire bundle with another wire bundleretention strap extending through the other wire bundle mountingstructure, where the wire bundle mounting structure and the other wirebundle mounting structure are spaced a predetermined distance from eachother along a length of the wire bundle.

C5. The method of paragraph C4, further comprising:

coupling another spanner bar to the structure, where the spanner bar andthe other spanner bar are spaced from each other by the predetermineddistance; and

coupling each of the wire bundle mounting structure and the other wirebundle mounting structure, with the wire bundle coupled thereto, to arespective one of the spanner bar and the other spanner bar.

C6. The method of paragraph C5 wherein the structure is an aircraftfuselage and the predetermined distance is a distance between framemembers of the aircraft fuselage.

C7. The method of paragraph C1, wherein the wire bundle mountingstructure is coupled to the wire bundle mounting recesses of the spannerbar without tools.

C8. The method of paragraph C1, further comprising coupling one wirebundle mounting structure to another wire bundle mounting structure in astacked arrangement.

C9. The method of paragraph C1, wherein coupling the wire bundlemounting structure to a wire bundle comprises:

inserting the wire bundle into the wire bundle mounting structure; and

coupling the wire bundle, disposed within the wire bundle mountingstructure, to the wire bundle mounting structure with the wire bundleretention strap.

D1. A method of forming a wire bundle, the method comprising:

removably coupling a plurality of wire bundle mounting structures to awire bundle form board, the plurality of wire bundles mountingstructures being coupled to the wire bundle form board in apredetermined pattern corresponding to a configuration (e.g., shape,wire routing, etc.) of the wire bundle;

inserting one or more wires, of the wire bundle, into the plurality ofwire bundle mounting structures;

coupling the one or more wires to the plurality of wire bundle mountingstructures with a respective wire bundle retention strap of each of theplurality of wire bundle mounting structures so as to form the wirebundle; and

removing the one or more wires and the plurality of wire bundle mountingstructures from the wire bundle form board as a singular unit.

D2. The method of paragraph D1, wherein the wire bundle mountingstructures are removably coupled to the wire bundle form board with arobotic automation.

D3. The method of paragraph D1, wherein the wire bundle mountingstructures are removably coupled to the wire bundle form board accordingto indicia, disposed on the wire bundle form board, specifying placementlocations of the wire bundle mounting structures for a predeterminedwire bundle.

D4. The method of paragraph D1, wherein the wire bundle form board iscommon to a first wire bundle and a second wire bundle, where the secondwire bundle has a different configuration than the first wire bundle.

D5. The method of paragraph D1, further comprising coupling theplurality of wire bundle mounting structures of the singular unit to oneor more spanner bars, where the one or more spanner bars are configuredfor coupling to a structure.

D6. The method of paragraph D5, wherein the structure is a frame of anaircraft.

D7. The method of paragraph D5, wherein the plurality of wire bundlemounting structures of the singular unit are coupled to the one or morespanner bars without tools.

D8. The method of paragraph D5, wherein each wire bundle mountingstructure of the singular unit is coupled to a respective wire bundlemounting recess of the one or more spanner bars with quick connectmounting features of the one or more spanner bars.

D9. The method of paragraph D1, further comprising inserting therespective wire bundle retention strap into a respective wire bundlemounting structure, where the respective wire bundle retention strap hasa first end pivotally coupled to a frame of the respective wire bundlemounting structure, and a second end having mating quick connect strapretention features that mate with quick connect strap retention featuresof the respective wire bundle mounting structure.

D10. The method of paragraph D9, wherein the respective wire bundleretention strap is inserted through the respective wire bundle mountingstructure at opposite ends of the respective wire bundle mountingstructure to form a wire bundle passage loop.

D11. The method of paragraph D10, further comprising adjusting a size ofthe wire bundle passage loop formed by the respective wire bundleretention strap and the respective wire bundle mounting structure bypulling the second end of the wire retention strap through therespective wire bundle mounting structure.

D12. The method of paragraph D1, further comprising:

stacking another plurality of wire bundle mounting structures to atleast some of the plurality of wire bundle mounting structures coupledto the wire bundle form board;

inserting one or more different wires into the other plurality of wirebundle mounting structures and coupling the one or more different wiresto the other plurality of wire bundle mounting structures so as to formanother wire bundle; and

removing the wire bundle and the other wire bundle from the wire bundleform board as the singular unit.

E1. A method of forming a wire bundle, the method comprising:

inserting at least one wire into at least one wire bundle mountingstructure; and

coupling the at least one wire to the at least one wire bundle mountingstructure with a respective wire bundle retention strap extendingthrough a respective wire bundle mounting structure, where each wirebundle retention strap has a first end pivotally coupled to a frame ofthe respective wire bundle mounting structure, and a second end havingmating quick connect strap retention features that mate with quickconnect strap retention features of the respective wire bundle mountingstructure;

wherein the at least one wire bundle mounting structure is common toboth

arranging the at least one wire in a predetermined configuration forformation of the wire bundle, and

mounting the wire bundle to a structure.

E2. The method of paragraph E1 further comprising coupling the at leastone wire bundle mounting structure, with the at least one wire coupledthereto to at least one spanner bar, where the at least one wire bundlemounting structure is coupled to a respective wire bundle mountingrecesses of a respective spanner bar with quick connect mountingfeatures of the respective spanner bar that mate the quick connectmounting features of the at least one wire bundle mounting structure.

E3. The method of paragraph E1, further comprising inserting therespective wire bundle retention strap into the respective wire bundlemounting structure.

E4. The method of paragraph E3, wherein the respective wire bundleretention strap is inserted through the respective wire bundle mountingstructure at opposite ends of the respective wire bundle mountingstructure to form a wire bundle passage loop.

E5. The method of paragraph E4, further comprising adjusting a size ofthe wire bundle passage loop formed by the respective wire bundleretention strap and the respective wire bundle mounting structure bypulling the second end of the wire retention strap through therespective wire bundle mounting structure.

E6. The method of paragraph E1, further comprising removable couplingthe at least one wire bundle mounting structure to a wire bundle formboard in a predetermined pattern corresponding to a configuration(shape, routing or wires, etc.) of the wire bundle.

E7. The method of paragraph E6, wherein the at least one wire bundlemounting structure is removably coupled to the wire bundle form boardwith a robotic automation.

E8. The method of paragraph E6, wherein the at least one wire bundlemounting structure is removably coupled to the wire bundle form boardaccording to indicia, disposed on the wire bundle form board, specifyingplacement locations of the wire bundle mounting structures for apredetermined wire bundle.

E9. The method of paragraph E6, wherein the wire bundle form board iscommon to a first wire bundle and a second wire bundle, where the secondwire bundle has a different configuration than the first wire bundle.

F1. A wire bundle forming apparatus comprising:

a wire bundle form board having a plurality of mounting structurecouplings; and

at least one wire bundle mounting structure configured to couple withthe plurality of mounting structure couplings for removably coupling theat least one wire bundle mounting structure to the wire bundle formboard in a predetermined pattern corresponding to a predeterminedconfiguration of a wire bundle, where,

the at least one wire bundle mounting structure has a wire receivingportion in which wires, forming the wire bundle, are placed and coupledto the at least one wire bundle mounting structure, and

the at least one wire bundle mounting structure is common to both

arranging the at least one wire in the predetermined configuration forformation of the wire bundle, and,

when removed from the wire bundle form board with the wire bundlecoupled to the at least one wire bundle mounting structure, a fixturefor coupling the wire bundle to a structure.

F2. The wire bundle forming apparatus of paragraph F1, furthercomprising a robot configured to at least couple the at least one wirebundle mounting structure to the wire bundle form board in thepredetermined pattern.

F3. The wire bundle forming apparatus of paragraph F1, wherein the atleast one wire bundle mounting structure includes:

quick connect mounting features that couple with both the plurality ofmounting structure couplings and a spanner bar of the fixture; and

quick connect strap retention features.

F4. The wire bundle forming apparatus of paragraph F3, furthercomprising:

a wire bundle retention strap having

a first end pivotally coupled to the at least one wire bundle mountingstructure, and

a second end having mating quick connect strap retention features thatmate with the quick connect strap retention features of the at least onewire bundle mounting structure to couple the second end to the at leastone wire bundle mounting structure.

F5. The wire bundle forming apparatus of paragraph F4, wherein:

the wire bundle retention strap includes a pivot axle and a strapportion extending from the pivot axle, and

the at least one wire bundle mounting structure includes an axle bearingsurface and a retention strap aperture through the axle bearing surface,the retention strap aperture being configured to receive the strapportion of the wire bundle retention strap and the axle bearing surfacecouples with the pivot axle so as to prevent passage of the pivot axlethrough the retention strap aperture.

F6. The wire bundle forming apparatus of paragraph F4, wherein the wirebundle retention strap and the at least one wire bundle mountingstructure form a wire bundle passage loop through which one or more wirebundles extend.

F7. The wire bundle forming apparatus of paragraph F6, wherein themating quick connect strap retention features extend along apredetermined length of the wire bundle retention strap so that the wirebundle passage loop has a variably sized wire passage aperture.

F8. The wire bundle forming apparatus of paragraph F4, where the quickconnect strap retention features and the mating quick connect strapretention features form a ratchet coupling.

F9. The wire bundle forming apparatus of paragraph F8, wherein theratchet coupling is configured so that the wire bundle retention strappasses through the quick connect strap retention features in a singlenon-reversible direction.

F10. The wire bundle forming apparatus of paragraph F3, wherein thequick connect strap retention features comprise:

a guide channel having an open side; and

a cantilevered toothed member disposed at the open side of the guidechannel.

F11. The wire bundle forming apparatus of paragraph F10, wherein thecantilevered tooth member is resilient so that a free end of thecantilevered tooth member moves relative to the guide channel.

F12. The wire bundle forming apparatus of paragraph F3, wherein:

the quick connect mounting features of the at least one wire bundlemounting structure include at least one first protrusion; and

each of the plurality of mounting structure couplings of the wire bundleform board include flexure members configured to snap over and retainthe at least one first protrusion.

F13. The wire bundle forming apparatus of paragraph F3, wherein:

the quick connect mounting features of the at least one wire bundlemounting structure include at least one second protrusion; and

each of the plurality of mounting structure couplings of the wire bundleform board include a recess into which the at least one secondprotrusion is received, where the coupling between the recess and the atleast one second protrusion forms a fulcrum of the quick connectmounting features.

F14. The wire bundle forming apparatus of paragraph F3, wherein:

each of the at least one wire bundle mounting structure includes a framehaving a first mounting structure end and a second mounting structureend; and

the quick connect mounting features include at least one protrusiondisposed at each of the first mounting structure end and the secondmounting structure end.

F15. The wire bundle forming apparatus of paragraph F14, wherein:

the first end of the wire bundle retention strap is pivotally coupled toa respective wire bundle mounting structure adjacent the first mountingstructure end; and

the second end of the wire bundle retention strap is coupled to therespective wire bundle mounting structure adjacent the second mountingstructure end.

F16. The wire bundle forming apparatus of paragraph F3, wherein thequick connect mounting features of the at least one wire bundle mountingstructure and the plurality of mounting structure couplings of the wirebundle form board are configured so that the at least one wire bundlemounting structure is coupled to wire bundle form board with single sideform board access.

F17. The wire bundle forming apparatus of paragraph F1, wherein:

the at least one wire bundle mounting structure includes a plurality ofwire bundle mounting structures; and

the plurality of mounting structure couplings of the wire bundle formboard form a plurality of wire bundle mounting recesses, the pluralityof wire bundle mounting recesses being arranged in a grid where eachwire bundle mounting recess is configured to couple with a respectiveone of the plurality of wire bundle mounting structures.

F18. The wire bundle forming apparatus of paragraph F1, wherein at leastone of the at least one wire bundle mounting structure includesstackable coupling features, the stackable coupling features beingconfigured to couple at least two wire bundle mounting structures toeach other in a stacked configuration.

F19. The wire bundle forming apparatus of paragraph F1, where the atleast one wire bundle mounting structure is selectable from a number ofdifferent wire bundle mounting structures, at least one of which has adifferent wire bundle interface surface than another of the differentwire bundle mounting structures.

In the figures, referred to above, solid lines, if any, connectingvarious elements and/or components may represent mechanical, electrical,fluid, optical, electromagnetic, wireless and other couplings and/orcombinations thereof. As used herein, “coupled” means associateddirectly as well as indirectly. For example, a member A may be directlyassociated with a member B, or may be indirectly associated therewith,e.g., via another member C. It will be understood that not allrelationships among the various disclosed elements are necessarilyrepresented. Accordingly, couplings other than those depicted in thedrawings may also exist. Dashed lines, if any, connecting blocksdesignating the various elements and/or components represent couplingssimilar in function and purpose to those represented by solid lines;however, couplings represented by the dashed lines may either beselectively provided or may relate to alternative examples of thepresent disclosure. Likewise, elements and/or components, if any,represented with dashed lines, indicate alternative examples of thepresent disclosure. One or more elements shown in solid and/or dashedlines may be omitted from a particular example without departing fromthe scope of the present disclosure. Environmental elements, if any, arerepresented with dotted lines. Virtual (imaginary) elements may also beshown for clarity. Those skilled in the art will appreciate that some ofthe features illustrated in the figures, may be combined in various wayswithout the need to include other features described in the figures,other drawing figures, and/or the accompanying disclosure, even thoughsuch combination or combinations are not explicitly illustrated herein.Similarly, additional features not limited to the examples presented,may be combined with some or all of the features shown and describedherein.

In FIGS. 8-10, referred to above, the blocks may represent operationsand/or portions thereof and lines connecting the various blocks do notimply any particular order or dependency of the operations or portionsthereof. Blocks represented by dashed lines, if any, indicatealternative operations and/or portions thereof. Dashed lines, if any,connecting the various blocks represent alternative dependencies of theoperations or portions thereof. It will be understood that not alldependencies among the various disclosed operations are necessarilyrepresented. FIGS. 8-10 and the accompanying disclosure describing theoperations of the method(s) set forth herein should not be interpretedas necessarily determining a sequence in which the operations are to beperformed. Rather, although one illustrative order is indicated, it isto be understood that the sequence of the operations may be modifiedwhen appropriate. Accordingly, certain operations may be performed in adifferent order or substantially simultaneously. Additionally, thoseskilled in the art will appreciate that not all operations describedneed be performed.

In the foregoing description, numerous specific details are set forth toprovide a thorough understanding of the disclosed concepts, which may bepracticed without some or all of these particulars. In other instances,details of known devices and/or processes have been omitted to avoidunnecessarily obscuring the disclosure. While some concepts will bedescribed in conjunction with specific examples, it will be understoodthat these examples are not intended to be limiting.

Unless otherwise indicated, the terms “first,” “second,” etc. are usedherein merely as labels, and are not intended to impose ordinal,positional, or hierarchical requirements on the items to which theseterms refer. Moreover, reference to, e.g., a “second” item does notrequire or preclude the existence of, e.g., a “first” or lower-numbereditem, and/or, e.g., a “third” or higher-numbered item.

Reference herein to “one example” means that one or more feature,structure, or characteristic described in connection with the example isincluded in at least one implementation. The phrase “one example” invarious places in the specification may or may not be referring to thesame example.

As used herein, a system, apparatus, structure, article, element,component, or hardware “configured to” perform a specified function isindeed capable of performing the specified function without anyalteration, rather than merely having potential to perform the specifiedfunction after further modification. In other words, the system,apparatus, structure, article, element, component, or hardware“configured to” perform a specified function is specifically selected,created, implemented, utilized, programmed, and/or designed for thepurpose of performing the specified function. As used herein,“configured to” denotes existing characteristics of a system, apparatus,structure, article, element, component, or hardware which enable thesystem, apparatus, structure, article, element, component, or hardwareto perform the specified function without further modification. Forpurposes of this disclosure, a system, apparatus, structure, article,element, component, or hardware described as being “configured to”perform a particular function may additionally or alternatively bedescribed as being “adapted to” and/or as being “operative to” performthat function.

Different examples of the apparatus(es) and method(s) disclosed hereininclude a variety of components, features, and functionalities. Itshould be understood that the various examples of the apparatus(es),system(s), and method(s) disclosed herein may include any of thecomponents, features, and functionalities of any of the other examplesof the apparatus(es) and method(s) disclosed herein in any combination,and all of such possibilities are intended to be within the scope of thepresent disclosure.

Many modifications of examples set forth herein will come to mind to oneskilled in the art to which the present disclosure pertains having thebenefit of the teachings presented in the foregoing descriptions and theassociated drawings.

Therefore, it is to be understood that the present disclosure is not tobe limited to the specific examples illustrated and that modificationsand other examples are intended to be included within the scope of theappended claims. Moreover, although the foregoing description and theassociated drawings describe examples of the present disclosure in thecontext of certain illustrative combinations of elements and/orfunctions, it should be appreciated that different combinations ofelements and/or functions may be provided by alternative implementationswithout departing from the scope of the appended claims. Accordingly,parenthetical reference numerals in the appended claims are presentedfor illustrative purposes only and are not intended to limit the scopeof the claimed subject matter to the specific examples provided in thepresent disclosure.

What is claimed is:
 1. A method of forming a wire bundle, the methodcomprising: removably coupling a plurality of wire bundle mountingstructures to a wire bundle form board, the plurality of wire bundlesmounting structures being coupled to the wire bundle form board in apredetermined pattern corresponding to a configuration of the wirebundle; inserting one or more wires, of the wire bundle, into theplurality of wire bundle mounting structures; coupling the one or morewires to the plurality of wire bundle mounting structures with arespective wire bundle retention strap of each of the plurality of wirebundle mounting structures so as to form the wire bundle; and removingthe one or more wires and the plurality of wire bundle mountingstructures from the wire bundle form board as a singular unit.
 2. Themethod of claim 1, wherein the wire bundle mounting structures areremovably coupled to the wire bundle form board with a roboticautomation.
 3. The method of claim 1, wherein the wire bundle mountingstructures are removably coupled to the wire bundle form board accordingto indicia, disposed on the wire bundle form board, specifying placementlocations of the wire bundle mounting structures for a predeterminedwire bundle.
 4. The method of claim 1, wherein the wire bundle formboard is common to a first wire bundle and a second wire bundle, wherethe second wire bundle has a different configuration than the first wirebundle.
 5. The method of claim 1, further comprising coupling theplurality of wire bundle mounting structures of the singular unit to oneor more spanner bars, where the one or more spanner bars are configuredfor coupling to a structure.
 6. The method of claim 5, wherein theplurality of wire bundle mounting structures of the singular unit arecoupled to the one or more spanner bars without tools.
 7. The method ofclaim 1, further comprising inserting the respective wire bundleretention strap into a respective wire bundle mounting structure, wherethe respective wire bundle retention strap has a first end pivotallycoupled to a frame of the respective wire bundle mounting structure, anda second end having mating quick connect strap retention features thatmate with quick connect strap retention features of the respective wirebundle mounting structure.
 8. The method of claim 1, further comprising:stacking another plurality of wire bundle mounting structures to atleast some of the plurality of wire bundle mounting structures coupledto the wire bundle form board; inserting one or more different wiresinto the other plurality of wire bundle mounting structures and couplingthe one or more different wires to the other plurality of wire bundlemounting structures so as to form another wire bundle; and removing thewire bundle and the other wire bundle from the wire bundle form board asthe singular unit.
 9. A method of forming a wire bundle, the methodcomprising: inserting at least one wire into at least one wire bundlemounting structure; and coupling the at least one wire to the at leastone wire bundle mounting structure with a respective wire bundleretention strap extending through a respective wire bundle mountingstructure, where each wire bundle retention strap has a first endpivotally coupled to a frame of the respective wire bundle mountingstructure, and a second end having mating quick connect strap retentionfeatures that mate with quick connect strap retention features of therespective wire bundle mounting structure; wherein the at least one wirebundle mounting structure is common to both arranging the at least onewire in a predetermined configuration for formation of the wire bundle,and mounting the wire bundle to a structure.
 10. The method of claim 9,further comprising removable coupling the at least one wire bundlemounting structure to a wire bundle form board in a predeterminedpattern corresponding to a configuration of the wire bundle.
 11. Themethod of claim 10, wherein the at least one wire bundle mountingstructure is removably coupled to the wire bundle form board with arobotic automation.
 12. The method of claim 10, wherein the at least onewire bundle mounting structure is removably coupled to the wire bundleform board according to indicia, disposed on the wire bundle form board,specifying placement locations of the wire bundle mounting structuresfor a predetermined wire bundle.
 13. The method of claim 10, wherein thewire bundle form board is common to a first wire bundle and a secondwire bundle, where the second wire bundle has a different configurationthan the first wire bundle.
 14. A wire bundle forming apparatuscomprising: a wire bundle form board having a plurality of mountingstructure couplings; and at least one wire bundle mounting structureconfigured to couple with the plurality of mounting structure couplingsfor removably coupling the at least one wire bundle mounting structureto the wire bundle form board in a predetermined pattern correspondingto a predetermined configuration of a wire bundle, where, the at leastone wire bundle mounting structure has a wire receiving portion in whichwires, forming the wire bundle, are placed and coupled to the at leastone wire bundle mounting structure, and the at least one wire bundlemounting structure is common to both arranging the at least one wire inthe predetermined configuration for formation of the wire bundle, and,when removed from the wire bundle form board with the wire bundlecoupled to the at least one wire bundle mounting structure, a fixturefor coupling the wire bundle to a structure.
 15. The wire bundle formingapparatus of claim 14, further comprising a robot configured to at leastcouple the at least one wire bundle mounting structure to the wirebundle form board in the predetermined pattern.
 16. The wire bundleforming apparatus of claim 14, wherein the at least one wire bundlemounting structure includes: quick connect mounting features that couplewith both the plurality of mounting structure couplings and a spannerbar of the fixture; and quick connect strap retention features.
 17. Thewire bundle forming apparatus of claim 16, further comprising: a wirebundle retention strap having a first end pivotally coupled to the atleast one wire bundle mounting structure, and a second end having matingquick connect strap retention features that mate with the quick connectstrap retention features of the at least one wire bundle mountingstructure to couple the second end to the at least one wire bundlemounting structure.
 18. The wire bundle forming apparatus of claim 14,wherein: the at least one wire bundle mounting structure includes aplurality of wire bundle mounting structures; and the plurality ofmounting structure couplings of the wire bundle form board form aplurality of wire bundle mounting recesses, the plurality of wire bundlemounting recesses being arranged in a grid where each wire bundlemounting recess is configured to couple with a respective one of theplurality of wire bundle mounting structures.
 19. The wire bundleforming apparatus of claim 14, wherein at least one of the at least onewire bundle mounting structure includes stackable coupling features, thestackable coupling features being configured to couple at least two wirebundle mounting structures to each other in a stacked configuration. 20.The wire bundle forming apparatus of claim 14, where the at least onewire bundle mounting structure is selectable from a number of differentwire bundle mounting structures, at least one of which has a differentwire bundle interface surface than another of the different wire bundlemounting structures.